Step 4 of the PCM Process

Metal cleaning or prep is next in our process; the importance of this step cannot be overemphasized.

Proper metal preparation, degreasing, and the removal of surface contaminants is essential for proper adhesion between the raw material and the photo resist during the coating process.

Why Is Cleaning So Critical To The Photo Etching Process?

Most photo resists have been developed for the printed circuit industry and have adequate adhesion to copper and copper alloys.

Care must be taken to promote adhesion when other materials are etched, especially stainless steel.

What Is Passivation

Passivation or pre-etchings are considerations as well as abrasion by mechanical means to texture the surface to be coated.

Modern PCM companies have invested in “clean lines” for improved material cleanliness.  These conveyorized machines are typically multi-chambered and material is put through a series of clean and rinses to ensure proper surface condition. 

The quality and quantity of the finished parts depends greatly on the care taken during this step.